Hero Intelligence has successfully established an independent system for mechanical design, automation design, and software development by assembling a research and development team composed of experts in semiconductor equipment manufacturing and high-end talents from the LCD industry, while also collaborating with higher education institutions for scientific research cooperation. This system has not only equipped the enterprise with the capability to manufacture various high-end automated production equipment but also achieved leapfrog development from scratch to excellence, ultimately surpassing international peers in the industry and achieving full localization.

In the LCD industry, the enterprise has successfully developed a series of high-end equipment such as COG, FOG, COF, AMOLED bonders, 3D laminators, fully automatic polarizer attaching machines, backlight assembling machines, backlight lamination machines, glass contour cutting machines, exposure machines, and developing machines. These equipment have improved production efficiency, reduced production costs, and simultaneously enhanced product quality and competitiveness.

In the semiconductor industry, the enterprise has also achieved remarkable results by successfully developing key equipment such as chip dispensing machines, DIE bonders, and COM chip mounters. The successful development of these equipment has not only raised the level of automation in semiconductor manufacturing but also propelled the rapid development of the semiconductor industry.

Furthermore, the enterprise has maintained a long-term partnership with Shenzhen Dewo Advanced Automation Co., Ltd., and together, they have successfully developed a gold wire bonder, breaking the long-term monopoly held by foreign countries.